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Through Silicon Via (TSV) Metrology

FilmTek™ 2000M TSV Metrology Advantages

  • Fully automated metrology platform for fast and reliable critical dimension, etch depth, and film thickness measurement over a wide range of TSV sizes and aspect ratios
  • CD precision (1σ) < 0.2%
  • Etch depth precision (1σ) < 0.3%
  • Film thickness range: 10nm - 350μm
  • Film thickness precision (1σ) < 0.005%
  • Measurement time of 3-8 seconds per point
  • Pattern recognition by Cognex
  • Lowest total cost of ownership

FilmTek™ 2000M TSV Measurement Sequence

                    

 

FilmTek™ 2000M Simultaneously Measures Critical Dimension, Etch Depth, and Film Thickness for TSV and MEMS Structures

 

 

                               

 

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