Characterizing Advanced Low-k Materials
- Advanced process control achieved with FilmTek's™ high resolution
measurement of optical constants and thickness using SCI's patented
Differential Power Spectral Density (DPSD) technology.
- Measure graded low-k films (e.g., after plasma damage) with
SCI's advanced modeling algorithms.
- Superior film characterization enables accurate and repeatable CMP
and trench depth process monitoring of multi-layer low-k film stacks
Low-k (As Deposited)
Low-k (Plasma Damaged)