FilmTek™ CD



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Spectroscopic, Multi-Angle Optical CD Metrology

FilmTek™ CD

FilmTek™ CD-A

FilmTek™ CD Features

Fast, non-destructive optical profile measurement

	Simultaneous measurement of thickness, refractive index, and multiple CD parameters including period, line width, trench depth, and sidewall angle
	Unique technology combines spectroscopic, multiple-angle polarized reflectometry and ellipsometry (240nm-1000nm) for industry leading sensitivity and performance
	Fast, real-time optimization allows for a wide range of applications with minimal setup time (no library generation necessary)
	Small spot achieved with patented optical technology (measures within a 50x50 micron feature)
	FilmTek™ CD uses proprietary Rigorous Coupled Wave Analysis (RCWA) and Generalized Ellipsometry (4x4 matrix generalization method) techniques to allow for a wide range of feature sizes including very small line widths (as small as 10nm)
	Fully automated for production or available as a low cost bench top unit for R&D applications

Optional features:

- Cassette to cassette wafer handling

- Pattern recognition (Cognex)

- 300mm, FOUP, and SMIF compatible

Optical Critical Dimension (CD) Metrology

FilmTek™ CD is a cost effective solution for non-destructive optical CD metrology applications, accurately and simultaneously determining period, line width, trench depth, and sidewall angle. Based on technology combining multiple-angle polarized spectroscopic reflection and generalized spectroscopic ellipsometry, FilmTek™ CD measures Psi (y, y_sp, y_ps), Delta (D, D_sp, D_ps), R_s, R_p, R_sp, and R_psat 0 and 70 degrees to provide highly accurate measurements of profile information and film-thickness with a single tool. FilmTek™ CD can also be used to characterize biaxial (anisotropic) materials.

FilmTek™ CD includes proprietary diffraction software with fast, real-time optimization. Real-time optimization allows the user to easily measure unknown structures with minimal setup time and recipe development while avoiding the time and complication associated with library generation. The combination of spectroscopic, multi-angle measurements with proprietary RCWA and Generalized Ellipsometry methods makes FilmTek™ CD ideally suited for advanced CD metrology applications with extremely small line widths. Available as a manual load, bench-top unit or fully automated with cassette to cassette wafer handling, FilmTek™ CD can be configured to suit a wide range of budgets and end use applications.

Applications

	Thickness, refractive index, and optical CD metrology
	Composition measurement
	Thickness of ultra-thin film stacks
	Broad range of critical dimension applications including gate CD, STI profile, contact holes, CMP trench, and patterned magnetic disks

Broad range of film applications including diffusion, CVD, etch, CMP, and SOI

FilmTek™ CD Performance Specifications (Thin Films)

Film(s)	Thickness	Measured Parameters	Precision (1σ)
Oxide / Si	0-1000 Å	t	0.03 Å
	1000-500,000 Å	t	0.005%
	1000 Å	t, n	0.2 Å / 0.0001
	15,000 Å	t, n	0.5 Å / 0.0001
	150,000 Å	t, n	1.5 Å / 0.00001
Photoresist / Si	1000-5000 Å	t	0.02%
Photoresist / Si	1000-5000 Å	t, n	0.05% / 0.0002
Nitride / Si	1000-5000 Å	t	0.02%
Nitride / Si	1000-5000 Å	t, n	0.05% / 0.0005
Polysilicon / Oxide / Si	850 Å / 55 Å	t Poly , t Oxide	0.2 Å / 0.1 Å
Polysilicon / Oxide / Si	850 Å / 55 Å	t Poly , t Oxide	0.2 Å / 0.0005

Related Information

FilmTek™ CD Product Overview.pdf

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