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FilmTek™ 3000, FilmTek™ 3000M, and  FilmTek™ 3000 PAR

FilmTek™ 3000 measures transmission and reflection of films deposited on transparent substrates. It is ideally suited for measuring the thickness and optical constants of very thin absorbing films deposited on transparent substrates.  FilmTek™ 3000 combines fiber-optic spectrophotometers with SCI's proprietary material modeling software to provide an affordable and reliable tool for the simultaneous measurement of film thickness, index of refraction, and extinction coefficient.  FilmTek™ 3000M has a small spot size (as small as 2 µm) and can be equipped with a large custom stage for flat panel display applications.  When equipped with the polarimetry option, FilmTek™ 3000P combines spectroscopic reflection, transmission, and polarimetry measurements for the accurate and simultaneous determination of optical constants and birefringence.  The FilmTek™ 3000 PAR utilizes SCI's patented parabolic mirror technology developed for the FilmTek™ 4000EM-DUV to achieve a 50mm measurement spot size and simultaneously measure wavelengths from the deep ultra-violet to the near infrared.  FilmTek™ 3000 provides unmatched accuracy, ease of use, and analytical power in a fully integrated package.

FilmTek™ 3000 Features

	Versatile: FilmTek™ 3000 incorporates SCI’s generalized material model with advanced global optimization algorithms for simultaneous determination of: - Multiple layer thicknesses - Indices of refraction [ n(l ) ] - Extinction (absorption) coefficients [ k(l ) ] - Energy band gap [ Eg ]         - Constituent and void fraction - Surface roughness
	Low Cost: The cost of ownership of FilmTek™ 3000 is a small fraction of comparable instruments.
	No Special Knowledge Required: FilmTek™ 3000 software is designed so that minimal experience in personal computers, thin film optical design, or measurement techniques is required.
	Complete "turn key" System: A fully integrated spectrophotometer measurement system with calibration, acquisition, and analysis software.
	Non-contact and non-destructive.
	Flexible: FilmTek™ 3000 hardware and software can be easily modified to satisfy unique customer requirements.
	Optional features:   - Computer controlled automated stage - Large custom stages for flat panel display applications - Small spot size (2 microns) - Polarimetry - Cassette to cassette wafer handling

Applications

Virtually all translucent films ranging in thickness from less than 100 angstroms to approximately 150 microns can be measured with high precision. Typical applications include:

Flat panel display

OLED

	Semiconductor and dielectric materials			Computer disks
	Multilayer optical coatings			Coated glass
	Optical antireflection coatings			Laser mirrors
	Electro-optical materials			Thin Metals

Example Films
	SiOx			a-Si			Alq3
	SiNx			a-C:H			HIL
	DLC			ITO			BEML
	SOG			Polysilicon			GEML
	Photoresist			Polyimide			GETL
	Thin Metals			Color Dye			REML

Example Substrates
	Silicon			GaAs
	SOI			Glass
	SOS			Aluminum

Technical Specifications

Hardware

FilmTek™ 3000 is a complete system, which includes:

	UV/VIS/NIR spectrophotometers
	UV/VIS/NIR light source
	Fiber optic cables
	Manual sample stage with optics.  X-Y stage for 100mm, 150mm and 200mm wafers is standard.
	Multi-core processor with Windows™ XP Operating System

Methodology

FilmTek™ simultaneously solves for refractive index n(l), extinction coefficient k(l), and thicknesses of multi-layer film structures.  A self-consistent solution is obtained by using SCI’s generalized dispersion formula to model fitted values of the dielectric function e (l).  The SCI dispersion formula is quite general and applies to metallic, amorphous, crystalline, and dielectric materials (Figures 1-3).  This approach allows the user to model complex multi-layer structures with reflection/transmission data.  Global optimization methods are used to obtain the best solution while avoiding local minima and minimizing sensitivity to the user’s initial guess of fitted parameters (e.g., layer thickness).  FilmTek™ optimizes both the reflectance and power density spectrum (FFT) simultaneously.  This unique feature allows for accurate thickness determination over a wide range of thickness (3nm to 350mm).

Fig. 1 n and k spectra of Silicon

Fig. 2 n and k spectra of SiO2

Fig. 3 n and k spectra of Tantalum

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